Roy White

EXECUTIVE-LEVEL Operations, Product Development, Program and Project Management


Areas of expertise:



Data Analysis & Evaluation · Team Building, Growth, & Motivation · Crisis & Change Management · P&L

Lean Manufacturing & Operations · Cost Analysis & Control · Personnel Hiring & Training

Project and Program Management  · Vendor & Customer Negotiations · Organizational Processes & Procedures · Business Growth Strategies · Budgeting & Finance · Product Development and Marketing 






Global capital equipment supplier of nanotechnology applications for the semiconductor industry.

Director of Operations                                                                                Oct 2006 to present
Director of Manufacturing                                                                          Jul 2004 to Oct 2006
Director of Applications                                                                             Feb 2001 to Jul 2004
Senior Staff Scientist and Customer Relations Specialist                        Oct 2000 to Feb 2001


Directed global manufacturing, field service, applications, supply chain, quality control, information technology, and facilities including personnel hiring, performance reviews, and team-building. Administered multimillion dollar budget. Led capital planning and managed P&L for corporate service and NanoBit divisions.  Supervisory experience up to and including Director level. Ensured on-schedule delivery of all company products and applications. Orchestrated and oversaw international applications support including equipment demonstrations and acceptances. Presented at industry symposia and conferences.


·         Member of executive staff guiding the company.  Advisor to CEO on reorganization, market, and strategy.  Recruited by CEO for last three roles to solve critical corporate issues, and to mentor project managers.

·         Envisioned and led cross-functional projects that improved consumable product line yields by >60% and cut returns by 80%. Improved YOY profitability for 7 consecutive years generating multimillion dollar savings.

·         Led cross functional technical marketing team to integrate stakeholders and resolve product issues for customers such as Samsung, Intel, IBM, Toppan, TSMC, Global Foundries, and Micron.

·         Led all aspects of securing and executing a multimillion dollar femtosecond laser ablation system development contract, culminating in a successful new product line that expanded our core competency.  This included proposal generation, requirements definition, budgeting, customer management, system design (DFM), build, and timely acceptance.

·         Led cross functional team responsible for engineering and operations integration of RAVE’s first acquisition.

·         Developed processes for screening M&A candidates, and performing due diligence and integration.

·         Customer and distributor interface for service, including negotiation of contracts up to $500k.

·         Boosted service revenues by 300%+ while maintaining 95% uptime on all covered systems.

·         Led project that cut IT costs by 33%, made email secure, and doubled company cell phones.

·         Defined procedures and policies that reduced build time by 40% and led to zero returned systems.

·         Launched training program. Developed and delivered courses on root cause analysis and other topics.

·         Developed and presented ideas for a 10% reduction in bill of materials (BOM) on a key product line.

·         Developed a lean manufacturing plan for our demo systems, reducing asset inventory by $4M.

·         Solved functional and public relations crises resulting from malfunctioning Original Equipment Manufacturer component and led client communications efforts, alleviating customer discontent.

·         Published over 20 technical papers and earned two patents.

Motorola Inc.

Premier global provider of wireless communications and home and network mobility equipment. 3rd largest manufacturer of wireless handset equipment.

Senior Staff Process Engineer, Lithography group                     Sept 1999 to Oct 2000


·         Cut inspection times by 33%+ and replaced human handling step through incorporating automation.

·         Spearheaded comprehensive capability and capacity analyses to support 3-year planning strategies.

·         Contributed to implementing automation of reticle tracking system, enhancing efficiency and output as a participant on a site-wide cross functional team to improve ASML productivity

·         Dramatically diminished the impact of reticle-based repeaters by creating a closed-loop analysis process.

·         Justified, purchased, installed, and qualified state of the art inspection equipment.

·         Participated on corporate level reticle management and productivity improvement team.

Intel Corporation

World’s leading manufacturer of microprocessors and platforms for PC market. $26B+ in revenues.

Project Manager, SEMATECH Lithography Group Assignee                             Aug 1996 to Sept 1999
Sr. Process Engineer, Intel Mask Organization                                                 Aug 1992 to Aug 1996
Process Eng: Diffusion, Thin Films, CMP, Materials, Wet Etch, Analysis Lab    Nov 1989 to Aug 1992


·         Led multi-million dollar Industry-wide lithography development projects for the research consortium SEMATECH. Improved project ratings by >35% despite members with competing agendas.

·         “Go to” guy for any back end yield excursion.  Led hard defect task force that reduced defects 50%.

·         Led equipment installation and defect reduction efforts resulting in >20% yield improvements.

·         Designed and documented processes for Intel Mask Organization’s initial ISO9000 certification.

·         Led cross functional multi-site engineering team that delivered process improvements saving over $750k annually in direct costs.

·         Managed internal and external vendor SPC programs, including audit and root cause reporting.

·         Led improvement project that improved throughput at planarization by 66% while simultaneously providing dramatically improved wafer to wafer variability and pad lifetime.

·         Implemented SPC and RFC’s (response flow checklist) in our area, and at suppliers.  Recognized leader and trainer in SPC and DOE.  Consulted by other groups.  Delivered SPC training to multiple suppliers.

·         Implemented pattern recognition software for thickness measurements of interlayer dielectrics, resulting in an 80% improvement throughput time, lower defect levels, improved measurement consistency, and eliminating the need for special test structures (increasing the amount of space for device structures).

·         Led project that improved yield and process capability (Cp and Cpk) in alloy and oxidation furnace processes via load position adjustments and temperature adjustments by zone.

·         Participated on corporate level teams to develop Best Known Methods (BKM) for microcontamination and wet stations.

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